Willig and Associates

PRODUCTS

Patented CMP pad conditioning disks.
High performance back grinding wheels.
Edge grinding wheels.
Slicing (singulation) blades.

WHAT'S NEW?

Mitsubishi Materials Corporation (MMC) offers advanced diamond abrasive products for the semiconductor industry. The products are outstanding and offer their customers optimum performance with improved uniformity and longer life, thus reducing the Cost of Consumables (CoC).

Chemical Mechanical Planarization (CMP) is one of the fastest growing and most critical technologies for advanced multi-level interconnects. Incomplete understanding of the subtle interactions between the wafer, pad and slurry limits the manufacturability of this technology. Pad conditioning is a critical function of the CMP process. Glazing of the pad surface and inadequate pad conditioning are primary causes for the decrease in removal rates. MMC’s patented Diamond CMP Pad Conditioners offer superior diamond retention to eliminate scratches. Their manufacturing processes also provide longer disk life and pad uniformity. Shape selection of the diamond (five in total) contributes to the superior performance of these products. Disks for oxide, Tungsten (W) and copper (Cu) processes are available.

Another critical process is wafer back grinding. This function is performed at the end of the process where the value of the wafer is at its peak. To meet this critical demand, MMC has developed a patented back grinding wheel that incorporates world-class surface quality into each wheel.

For additional information, visit their web site at: www.mmc.co.jp/english/top_e.html